Barbara Ewa Ciecińska

Barbara Ciecińska is the lecturer and researcher at Rzeszow University of Technology (Poland) since 1997. She is interested in modern and innovative technologies in machine building. For many years she has been conducting research on the possibilities of application of unconventional methods in order to minimize materials use and the development of parameters of machine parts. The research was crowned in 2004 by a PhD thesis on shot peening technology and its application for the improvement of fatigue strength in unconventional parts of the machine (parts with decarburized surface layer). Currently her main area of interest are the problems of restoring exploitation properties to machine parts, their quality and durability. For several years, she has been conducting experimental research in the field of adhesive bonding, paying particular attention to the chemicals used in this process and their harmfulness to human and the environment. She carries out research on the possibility of replacing harmful processes of surface preparation before adhesive bonding and improving the adhesion conditions by laser beam treatment. In addition, in the last two years, she has extended the scope of research to include laser cutting technology for plastics, as one of non-waste methods in machine building. She has cooperated with plants and research-educational organization in the laser treatment usage area for five years. She conducts her research closely with the Technical University in Kosice, the Faculty of Mathematics and Natural Sciences at University of Rzeszow, the Faculty of Mathematics and Applied Physics at Rzeszow University of Technology, TRUMPF Poland and SPI Lasers United Kingdom. She is a member of the Polish Society of Production Management, the Science Council of Technical Issues Journal and the Science for Industry and the Environment Foundation.

Publications

Using Lasers as Safe Alternatives for Adhesive Bonding: Emerging Research and Opportunities
Barbara Ewa Ciecińska. © 2020. 248 pages.
Technology has brought about the age of convenience, but at a hefty cost. As a result of a growing production demand on a global scale, adhesive bonding operations also generate...